Product Overview

Integrated laser polishing and automatic tinning function, suitable for polishing and tinning nickel chromium alloy pads of sensor strain gauges and connecting FPC terminals. Equipped with a high-definition visual alignment system and precision servo transmission structure, relying on non-contact laser technology to remove surface oxide layers and impurities, and completing soldering operations at designated points, the thermal impact range is small and will not damage the substrate and internal components. Suitable for multi field product processing of core sensors such as aerospace military industry, consumer healthcare, weighing instruments, collaborative robots, humanoid robots, etc. Improve traditional defects such as poor soldering, uneven solder joints, virtual solder joints, and damaged components.

Product Features

1. Laser activation treatment on the surface of the solder pad greatly improves weldability, and the tin layer adheres firmly and is not easily peeled off

2. Closed loop temperature control controls heat output to avoid high temperature damage to strain gauges, insulation sheaths, and precision circuits

3. Automated tin feeding and melting, with full and regular tin dots, ensuring consistency in appearance and performance through mass production

4. The size of the light spot is flexible and adjustable, suitable for processing narrow areas such as flat deep hole solder pads and dense pins

5. Support process customization to meet different quality acceptance standards

Technical parameters

Parameter project technical specifications

Equipment model PJAE-LS200

Laser power 5W/UV

Laser wavelength 355nm

Adjustable range of light spot 0.2~1.0mm

Temperature control accuracy ± 5 ℃, precise closed-loop temperature control

Positioning accuracy ± 0.02mm

Operation mode: fully automatic polishing+tin plating integration, supporting customized non-standard processes

Suitable for workpiece strain sensor pads and FPC wiring terminals

Application field

Core components of six dimensional force sensors for military aerospace, new energy components, AI terminal electronics, medical sensing modules, weighing scales, collaborative robots, and humanoid robots